David Burkhardt

[David Burkhardt @david_tweet]

@OneRaichu It could also be a bandwidth bottleneck. Also isn't the 8P0E score using AVX512? The latter has much higher strain on bandwidth, while lower precision and integer workload put more emphasis on Latency.

[David Burkhardt @david_tweet]

@LordsManor Looking pretty!
I see you are testing the manor without bailey and i spot a lot more fields than usual in the demo. I agree with the latter!

+1 to my fore-commenter: Fishing would be really awesome. Take your time, although i fear post launch time will be even more precious.

[David Burkhardt @david_tweet]

@LordsManor I would still keep choice to place the keep, tax collector and tower as part of the wall as well as inside of it. Auto-correction of the walls is appreciated, because in the demo they would often not line up very well.
2/2

[David Burkhardt @david_tweet]

@LordsManor e) Require the player to make space by building a second circumference palisade. Inner walls can then be upgraded to stone walls. As soon as one full stone circumference is finished, the keep is also upgradeable.
1/2

[David Burkhardt @david_tweet]

@SteakandChickn @rrw63330 Job posts don't mean anything. If C-lvl wanted to drop AXG, HR definitely would not know. Nobody will know before the dissolving plan is final. Also C-lvl does not care at all if there are people hired just a few weeks or days ago.

[David Burkhardt @david_tweet]

@dickerwong @Design4Mind317 @vincent_wong_ @greymon55 there is no glue involved in 3d stacking other than the usual underfill that every flip chip package has. What TSMC does is direct bonding. The metal contacts of each chip are directly bonded together, like a weld, but using lower temperatures and chemical activation

[David Burkhardt @david_tweet]

@wassickt But that 'hiding seams with a support silicon' would be exactly how AMD explained how it would be made in its ISSCC '22 presentation.
I wonder what you expected to see with an IR camera on an unpowered silicon? Hardly anything?

[David Burkhardt @david_tweet]

@apmassaro3 The reason why Businessmen are attracted so much to dictators is that it is the same model they run their company on.
There are very few companies which are not managed top down and where actual free market ideas are used internally. @valvesoftware is one of the very few that try

[David Burkhardt @david_tweet]

@FreyaHolmer @diharaw94 Z-up is used by a lot of modeling software for Architecture and Design, Rhino, Archicad, Sketchup etc. because the top view is the default construction plane and x and y are its default axes.
Z is always from screen into the face 😂

[David Burkhardt @david_tweet]

@pcgamer Pointless, it's purely CPU limited: At 1080p_med a 5700xt performs identical to a 3080ti when both are running on a 5950x.

At least it shows they have the driver overhead under control.

[David Burkhardt @david_tweet]

@greymon55 Why no Samsung 24Gbps GDDR6 for the top dog? It should be available by then.

[David Burkhardt @david_tweet]

@Redfire75369 Intel showing bogus lab numbers. Shipping products never achieved close to 50% of those densities. TSMC and Samsung do.

[David Burkhardt @david_tweet]

@ayxerious @Wasmachineman It's a shame since they redesigned the socket with new mounting holes too. Could have gone for 100x100mm holes, a beefier Al-extrusion and slapped a 110-120mm Fan onto it, which would help mosfets and dimm temp. And it would not have cost substantially more. Missed opportunity 😠

[David Burkhardt @david_tweet]

@ayxerious @Wasmachineman yes and they are not only tiny, but also badly engineered.
by a marketeer, not an engineer.
the old boxed designs could at least be described as "ressource efficient"

[David Burkhardt @david_tweet]

@ayxerious It looks like these black lamellas are part of the plastic fan frame. Beneath it is essentially the same heatsink design as the old boxed heatsinks, only worse.

The fancy plastic frame now makes the Fan look bigger but actually isn't and introduces new noise and pressure drop.

[David Burkhardt @david_tweet]

@GPUsAreMagic @IanCutress With narrow side i still mean the long edge of the Package/DIE. Maybe a picture explains better what i mean. I know the DIE looks a lot like memory PHYs on the south, but apparently they are located in the north

[David Burkhardt @david_tweet]

@GPUsAreMagic @IanCutress Not really, or did you rotate the picture? The SI is on the long and spacious side of the package. PCIe is on the narrow side where the DIE is closer to the package edge This is the same with all XE packages, the 128EU and even DG1 already.

[David Burkhardt @david_tweet]

@LeaksApplePro Looks like a slice of an aluminium extrusion and two flat sheet metal/glas panels. Those are some extremely simple to manufacture parts. The upper plate will most probably be a glass panel like the imac and expect the lower one to have some additional intake ventilation holes.

[David Burkhardt @david_tweet]

@TDevilfish @Kepler_L2 @Jens_TX @3DCenter_org GDDR6X also doesn't exist in the JEDEC spec. Despite that it has been shipping in products since almost a year. The GDDR6 spec originally planned to do 24Gbit and 32Gbit at a later date, as @rdkmy3002 linked.