gdch

Just interested in new things.

[gdch @gdch12021652]

RT @intel: Meet Googlebook.

A new laptop experience from @Google and @Android, engineered for anything.

Learn more 👉 https://t.co/Jp1NzQT…

[gdch @gdch12021652]

iGPUs

[Hassan Mujtaba @hms1193]

Nova Lake 18A-P ✅

[Jaykihn @jaykihn0]

@promptingman Yes. It’s either Copper Shark P + Golden Eagle E, or Copper Shark P + Copper Shark E, depending on the validation status of the Copper Shark E-core, as of information from months prior.

Given that it uses Copper Shark either way, it is unified either way.

[Lip-Bu Tan @LipBuTan1]

Yesterday, @intel completed our planned capital raise of $20B in one of the largest follow-on equity offerings on record. With strong support from targeted long-term sovereign funds, fundamental growth and institutional investors, specialty hedge funds and retail investors, the round was oversubscribed >5X our initial goal.

Many thanks to our underwriters JP Morgan, Goldman Sachs, Morgan Stanley and Citigroup for their excellent support. With this additional capital, Intel is now well positioned to meet the tremendous growth opportunity ahead of us in advanced node wafer manufacturing, advanced packaging and the massive CPU demand. We remain laser focused on execution across all our businesses.

Along with the full support of our Board, my leadership team and I are fully committed to delivering strong returns to our shareholders in the coming years and to building a new and vibrant Intel.

[Intel Foundry @Intel_Foundry]

Explore the latest Intel Foundry innovations, from Intel 18A-P platform momentum at VLSI and AI systems showcased at Computex to advanced packaging breakthroughs from ECTC. Plus, dive into the updated Intel 18A family brief and the latest ecosystem milestones helping advance next-generation AI.

Discover the latest advancements in this edition of Intel Foundry Focus: https://t.co/vPdP0YZ60h

#IntelFoundry

[Thomas Kurian @ThomasOrTK]

We are expanding our strategic partnership with @Intel to accelerate their enterprise-wide digital transformation using Gemini Enterprise and @GoogleCloud. By integrating custom, agentic AI workflows across core business functions and silicon design, Intel will drive new levels of speed, agility, and efficiency across their global operations.

[The Inteller @IntelProMUltra]

People underestimate the significance of Intel using High-NA EUV (HNA EUV) for selected Panther Lake layers on Intel 18A... First of all, Pat Gelsinger’s bold bet is starting to pay off.

- 14A de-risking: Intel gains real production experience with HNA before broader 14A deployment.
- Technology lead: While TSMC plans to extend Low-NA EUV through 2030, Intel could build a four-year learning advantage. (Tell me who used EUV 4 years earlier than Intel?)
- Capacity flexibility: HNA provides another scaling path beyond increasingly crowded NXE capacity, and that's critical for Intel to expand its capacity smoothly.
- Fab 62 migration: Market intelligence suggests F62 may install HNA tools and host initial 14A capacity. Now, using HNA on 18A makes the installation and the migration far more natural.
- Lower Process cost: High-NA may not be economical today because of throughput, reliability and utilization challenges. But if Intel can solve these issues over the next four years, it could gain a meaningful process-cost advantage over the peers.
- Intel-ASML partnership: Intel needs High-NA to regain process leadership, while ASML needs a successful production advocate.

[Intel Foundry @Intel_Foundry]

Intel is investing €5B to expand advanced semiconductor manufacturing in Europe. Upgrades to Intel Foundry's Ireland facilities will scale capacity for Intel Xeon 6 and next-gen Intel Xeon processors on Intel 3 while strengthening Europe's semiconductor supply chain.

Learn more: https://t.co/r3ZfhWlF8O

#IntelFoundry

[TechPowerUp @TechPowerUp]

Intel Nova Lake-S and -H CPUs To Feature 12-Core Arc Xe3P iGPUs https://t.co/YjoTvL3ant

[Jaykihn @jaykihn0]

Nova Lake brings hardware accelerated DNx VC-3 (DNxHD, DNxHR) and JPEG XS decode

[Intel Foundry @Intel_Foundry]

Silicon Valley helped shape the modern technology industry, and Intel has been part of that story from the beginning.

Today, we're building on more than four decades of Intel Mask Operations at our Bowers Campus with expanded manufacturing capabilities that will help support future semiconductor innovation and manufacturing capacity around the world. We are proud to celebrate this moment alongside our Intel leadership team Lip-Bu Tan, Naga Chandrasekaran, and Frank Abboud with support from Skanska, our local and Santa Clara partners Mayor Lisa Gillmor, and global suppliers who enable our technology.

As America approaches its 250th anniversary, we're investing in what's next.

[Intel Foundry @Intel_Foundry]

Intel 18A-P has entered risk production.

At #VLSI2026, Intel Foundry shared new platform innovations, including Power Boost technology, expanded device options, and co-optimization advancements that enhance performance and design flexibility.

Plus, a look at the research shaping what's next. https://t.co/ngj84wVZvT

#IntelFoundry #Semiconductors

[Lip-Bu Tan @LipBuTan1]

Super excited to welcome my close friend Seok-Hee Lee back to Intel! @seokhee4 is a highly regarded semiconductor process integration expert and successful CEO (SK Hynix). Early in his career, he spent over 10 years at @intel, contributing to several critical Intel process technologies. He will now oversee our advanced packaging technology development and drive exciting new system integration projects! Advanced packaging and system integration are increasingly critical areas for Intel Foundry and for the future of computing. Seok-Hee will help Intel accelerate the ramp of our industry leading EMIB-T and HBI technologies. I look forward to partnering with him and have him rejoin Intel at this critical time!

https://t.co/DfPaWAWMZM

[Intel @intel]

Seok-Hee Lee joins Intel as EVP, @Intel_Foundry, to lead advanced packaging and back-end manufacturing, strengthening our ability to deliver system-level innovation.

Naga Chandrasekaran will continue to lead front-end technology development, manufacturing, design enablement, and the end-to-end customer and business-facing functions that support foundry’s growth.

Navid Shahriari will retire after 37 years at Intel. His contributions helped advance Intel’s back-end technology leadership.

Learn more: https://t.co/VVXwJ6b7kZ

[Ben Bajarin @BenBajarin]

Intel quantum wafer.

Large square 400 qubits.

$INTC

[🌿 lithos @lithos_graphein]

This is interesting. Intel 18A features two different approaches to juicing the rails: the standard deep power via, and a second option that taps directly into the MOL contact layer.

[Andreas Schilling 🇺🇦 @aschilling]

Intel at the @VLSI_2026 on #Intel18A-P:

- +18% lower power at iso-performance
- +9% fully routed block level performance at iso-power
- +20-40% improved thermal resistance
- new 5th logic Vt pair
- new W3P device in 180CH and 160CH

https://t.co/k59twiO0wI

[Intel Foundry @Intel_Foundry]

At #VLSI2026, Intel Foundry showcased innovations powering the future—from Intel 18A-P advancements like Power Boost and backside power delivery to next-generation technologies.

Read more: https://t.co/g93LmwOkOI

#IntelFoundry

[Andreas Schilling 🇺🇦 @aschilling]

New logic Vt offering for #Intel18A-P:

- ULVTLL (ultra low voltage low leakage) between LVT and ULVT.

Via a thinner handling wafers, new materials and optimized EDA tool flow the thermal conductivity is improved.

#Intel18A-P is currently in risk production

[Andreas Schilling 🇺🇦 @aschilling]

Details on the new device offerings for #Intel 18A-P:

- W1 (180CH) and W1.5 (160CH) for low power
- W3P in 180CH and 160CH for higher performance
- W3P with dual contact (front side and direct backside contacts enabled by PowerVia)