JulΞs

engineering -- ex @nova_credit @routablehq @invtechinc. Mr @VictoriaRamm4

[Tom @TomSzczypka]

Huawei's head of semiconductors just dropped an academic paper. Moore's Law is done. Shrinking transistors no longer makes chips faster or cheaper.

"Over 80% of energy in a large AI cluster is consumed by data movement." 80% of the cost of running AI is moving data between chips, between racks, between memory and logic.

Huawei's answer: optical interconnect at the package, 3D stacking, memory-logic fusion. They built an 8 Tb/s optical engine called Hi-ONE and a unified fabric that cuts latency 500x.

NVIDIA arrived at the same answer independently with Celestial and NVLink.

The paper literally says packaging, memory bandwidth, and fabric design now command the strategic weight that the leading-edge logic node alone previously held.

Here's what that maps to:

Packaging: $FOCI, ShunSin (https://t.co/HiYmxApdCg), $TSEM, $BESI
Memory bandwidth: SK Hynix (000660.KS), $MU, $SNDK
Optical fabric: $SIVE, $AAOI, $LITE, $COHR
Optical architecture: $MRVL, $NVDA
Substrates: $SOI, $IQE
Equipment: $AEHR, $AIXA

The head of Huawei's chip division is telling capital allocators where the next dollar should go.

[Daniel Romero @HyperTechInvest]

Stocks to Play Rubin Rack Manufacturing

━━━━━━━━━━━━━━━━━━
🧠 MEMORY
━━━━━━━━━━━━━━━━━━

DIRECT

→ SK hynix, 000660.KS, HBM leader
→ Micron, $MU, HBM3E/4, SOCAMM, DC DRAM
→ Samsung, 005930.KS, HBM, DRAM, SOCAMM

EQUIPMENT & PROCESS

→ Hanmi Semi, 042700.KS, HBM bonding
→ BE Semi, $BESI.AS, hybrid bonding
→ ASMPT, https://t.co/EaGCe3vWhV, advanced packaging and bonding
→ Disco, 6146.T, wafer grind, thinning and dicing
→ Advantest, 6857.T, memory test
→ Teradyne, $TER, semiconductor test
→ FormFactor, $FORM, probe cards
→ Technoprobe, $TPRO.MI, probe cards
→ Camtek, $CAMT, advanced packaging inspection
→ Onto Innovation, $ONTO, HBM metrology
→ KLA, $KLAC, inspection and yield

━━━━━━━━━━━━━━━━━━
🔌 AI SERVER PCB
━━━━━━━━━━━━━━━━━━

MANUFACTURERS

→ WUS, https://t.co/s5DAoyULTm, high-layer AI server PCB
→ Gold Circuit, https://t.co/nHKZNYE0Xw, multilayer PCB
→ Unimicron, https://t.co/3zWLwnp3nz, PCB and substrate
→ Tripod, https://t.co/kh1sqadnEL, server PCB
→ Nan Ya PCB, https://t.co/GogrOx2kMX, PCB and substrate
→ Compeq, https://t.co/rZNR6Tnn9H, PCB
→ Shennan, https://t.co/RSKyOxWyAJ, high-end PCB
→ Victory Giant, https://t.co/v3JYjgUxyK, AI server PCB
→ TTM Technologies, $TTMI, high-end PCB in the US
→ AT&S, $ATS.VI, PCB and substrate
→ Meiko, 6787.T, PCB

MATERIALS, CCL / LAMINATE

→ Elite Material, https://t.co/6uLuQmWRvT, high-speed CCL
→ ITEQ, https://t.co/2RUNRg5wV4, CCL
→ Taiwan Union Tech, 6274.TWO, high-speed laminate
→ Kingboard, https://t.co/Zi8S1eKO5L, CCL
→ Shengyi, https://t.co/WhkBv9Jzkg, CCL
→ Panasonic, 6752.T, electronic materials
→ Rogers, $ROG, high-frequency materials
→ Mitsubishi Gas Chemical, 4182.T, PCB and substrate materials
→ DuPont, $DD, electronic materials
→ Doosan, 000150.KS, CCL

━━━━━━━━━━━━━━━━━━
⚡ MLCC & PASSIVES
━━━━━━━━━━━━━━━━━━

MANUFACTURERS

→ Murata, 6981.T, global MLCC leader
→ Samsung Electro-Mechanics, 009150.KS, high-end MLCC
→ TDK, 6762.T, MLCC and passives
→ Taiyo Yuden, 6976.T, MLCC
→ Yageo, https://t.co/VbgLRIJl1u, MLCC and passives
→ Walsin, https://t.co/C3IBwMfYQj, MLCC and passives
→ Kyocera, 6971.T, ceramics and MLCC
→ Vishay, $VSH, passives
→ Chaozhou Three-Circle, https://t.co/lL2Vj0KgBq, MLCC and ceramics
→ Fenghua, https://t.co/e4zVGFoSz4, MLCC and passives
→ Holy Stone, https://t.co/w87YStCWBM, MLCC
→ Samwha, 001820.KS, capacitors

MATERIALS

→ Nippon Chemical Industrial, 4092.T, MLCC ceramics
→ Sakai Chemical, 4078.T, barium titanate
→ Toda Kogyo, 4100.T, electronic materials
→ Toho Titanium, 5727.T, titanium feedstock

━━━━━━━━━━━━━━━━━━
🌐 NVLINK / NETWORKING
━━━━━━━━━━━━━━━━━━

CHIPS & CONNECTIVITY

→ NVIDIA, $NVDA, NVLink, NVSwitch, ConnectX, BlueField and Spectrum
→ Marvell, $MRVL, DSPs, custom silicon and optical
→ Astera Labs, $ALAB, PCIe and CXL retimers
→ Credo, $CRDO, AECs and high-speed connectivity
→ MACOM, $MTSI, optical and high-speed connectivity
→ MaxLinear, $MXL, high-speed connectivity

OPTICAL & MODULES

→ Coherent, $COHR, lasers and optics
→ Lumentum, $LITE, lasers and optics
→ Fabrinet, $FN, optical module manufacturing
→ Zhongji Innolight, https://t.co/xtHBonQtOE, transceivers
→ Eoptolink, https://t.co/XNXUx6E1HX, transceivers
→ Accelink, https://t.co/YaNNS14h7J, optical modules
→ Cisco, $CSCO, Acacia coherent optics
→ AIXTRON, https://t.co/UPrvRe3wGM, InP MOCVD tools
→ AXT, $AXTI, InP substrates

CONNECTORS & CABLES

→ Amphenol, $APH, high-speed connectors and cables
→ TE Connectivity, $TEL, connectors
→ Luxshare, https://t.co/IPEpHC2lwa, cables and connectors
→ FIT Hon Teng, https://t.co/IcDWK2e2TP, connectors and cables
→ BizLink, https://t.co/FN3YiaEuDI, cable assemblies

━━━━━━━━━━━━━━━━━━
📦 ABF SUBSTRATE
━━━━━━━━━━━━━━━━━━

MANUFACTURERS

→ Ibiden, 4062.T, high-end ABF
→ Unimicron, https://t.co/3zWLwnp3nz, ABF and IC substrate
→ Nan Ya PCB, https://t.co/GogrOx2kMX, ABF and IC substrate
→ Kinsus, https://t.co/O71MimzVz2, IC substrate
→ AT&S, $ATS.VI, IC substrate
→ Samsung Electro-Mechanics, 009150.KS, FC-BGA
→ Simmtech, 222800.KQ, package substrate
→ Kyocera, 6971.T, ceramic and package substrate
→ Daeduck, 353200.KS, package substrate

MATERIALS

→ Ajinomoto, 2802.T, ABF film
→ Resonac, 4004.T, semiconductor packaging materials
→ Mitsubishi Gas Chemical, 4182.T, substrate and PCB materials
→ Mitsui Chemicals, 4183.T, packaging materials
→ Toray, 3402.T, advanced materials
→ DuPont, $DD, electronic materials

[Gavin Baker @GavinSBaker]

Always enjoy my conversations with @patrick_oshag

Points if you can guess whose office this was filmed in.

Also looks like I might need to up my dose of Tirzepatide. 😂

[Damnang2 @damnang2]

https://t.co/RE8MY8jQk9

[Mark™ @thinkwithmark]

We raised $1M dollars to reinvent how people read. Introducing Mark II - a $159 AI bookmark. Thread below

[JulΞs @julesterrien]

@thinkwithmark @thinkwithmark does the highlighter work on kindle or just paper? Feels like it wouldn’t make a difference but pls confirm

[Luc @investingluc]

Rotation people!! How to spot it:

Think back to january...we witnessed a HUGE rotation from software into semiconductors.

Thinking logically...that big $$$ that rode semis to ATHs is going to eventually take profit and rotate elsewhere.

Not saying the semiconductor run is over, but software seeing some renewed strength makes me think we're in the early stages of a short term rotation out of semis.

The question is...into where?

First, how can you tell when rotation is happening?

- former leaders stop reacting well to good news
- relative strength starts shifting
- watching major ETF flows (see screenshot)
- leadership narrows before rotation (1-2 stocks carrying the whole theme)
- new narrative emerges + sexier story
- expansion happening in a different theme

The caveat is don't be too early to rotate out of the strong theme...wait for confirmation of weakness + lower highs.

Some sauce:
> go to finviz
> make a watchlist of all the top ETFs
> rank by performance (week, month, Q)
> see where the strength has been on longer timeframes
> see where the strength is starting to appear on shorter timeframes

Gives you an idea on where $$$ has been + where $$$ could be rotating into...so you can focus some attention to potentially find the next leading sector.

[Jakub Antalik @Jakubantalik]

Built an animated Liquid Metal border component library with built-in reflections on neighboring components, multiple styles and color modes, dark & light mode

https://t.co/fxDfTP7Gkl
npm install metal-fx

[TheValueist @TheValueist]

DRAM & HBM manufacturers
Micron Technology (MU)
SK hynix (000660.KS)
Samsung Electronics (005930.KS)
Nanya Technology (https://t.co/ooj6qINcxj)
Winbond Electronics (https://t.co/piTXBJeTUk)
Etron Technology (5351.TWO)
Elite Semiconductor Microelectronics Technology (https://t.co/mXLMozg8ko)

NAND & flash manufacturers
SanDisk (SNDK)
Kioxia Holdings (285A.T)
Micron Technology (MU)
SK hynix (000660.KS)
Samsung Electronics (005930.KS)
Winbond Electronics (https://t.co/piTXBJeTUk)
Macronix International (https://t.co/kPoXPIYJcm)
GigaDevice Semiconductor (https://t.co/q3fvLm2kQL)
NOR flash & embedded non-volatile memory
Macronix International (https://t.co/kPoXPIYJcm)
Winbond Electronics (https://t.co/piTXBJeTUk)
GigaDevice Semiconductor (https://t.co/q3fvLm2kQL)
Infineon Technologies (https://t.co/ASBPgV4g1K)
STMicroelectronics (STM)
Microchip Technology (MCHP)
Micron Technology (MU)
Renesas Electronics (6723.T)
SSD & memory controller vendors
Phison Electronics (https://t.co/bo8fJMKnac)
Silicon Motion Technology (SIMO)
Maxio Technology (https://t.co/gASg1gnyI3)
FADU (440110.KQ)
Marvell Technology (MRVL)
JMicron Technology (4925.TWO)
Microchip Technology (MCHP)
DDR5 DIMM chipsets (RCD, data buffer, SPD hub, PMIC)
Renesas Electronics (6723.T)
Rambus (RMBS)
Montage Technology (https://t.co/Sz3L9NXfx2)
CXL memory controllers & connectivity
Astera Labs (ALAB)
Microchip Technology (MCHP)
Marvell Technology (MRVL)
Memory module manufacturers (server/enterprise/industrial/consumer)
Penguin Solutions (PENG)
Netlist (NLST)
ADATA Technology (https://t.co/MGwPrj62va)
Team Group (https://t.co/xzkHFbBJ7a)
Transcend Information (https://t.co/KqVv07mTbw)
Innodisk (5289.TWO)
Apacer Technology (https://t.co/Qo92P1KFIc)
Longsys (https://t.co/uP3Ha0EShD)
BIWIN Storage Technology (https://t.co/9Jvt634JiL)
HDD manufacturers (OEMs)
Seagate Technology (STX)
Western Digital (WDC)

HDD key component suppliers
Nidec (6594.T)
MinebeaMitsumi (6479.T)
TDK (6762.T)
NHK Spring (5991.T)
Resonac Holdings (4004.T)
HOYA (7741.T)

Advanced packaging & interposers for HBM (foundry/OSAT)
Taiwan Semiconductor Manufacturing Company (TSM)
ASE Technology (https://t.co/Q5SNSEinRo)
Amkor Technology (AMKR)
JCET Group (https://t.co/PCGBp0l73z)
ABF substrate makers & materials
Ibiden (4062.T)
Unimicron Technology (https://t.co/4dlZcYojkz)
AT&S (https://t.co/ZcdV8h0ytn)
Nan Ya Printed Circuit Board (https://t.co/zGobix7osM)
Kinsus Interconnect Technology (https://t.co/doC5P9bN7L)
Samsung Electro-Mechanics (009150.KS)
Ajinomoto (2802.T)
HBM/DDR/CXL interface IP providers
Cadence Design Systems (CDNS)
Synopsys (SNPS)
Rambus (RMBS)
Alphawave Semi (AWE.L)
Enterprise flash storage systems (arrays)
Pure Storage (PSTG)
NetApp (NTAP)
Dell Technologies (DELL)
Hewlett Packard Enterprise (HPE)
Hitachi (6501.T)

[Serenity @aleabitoreddit]

If you're curious about Goldman's Report:

They expect "significant EPS upside" among:

1. Optical modules and engines
2. CW lasers and EMLs
3. PCB/CCL manufacturers

Here's the massive cheat sheet:

Laser / Light Sources (SiPh): Sumitomo, Furukawa (5801), Landmark (3081), YJ Semi, $LITE, $COHR $AVGO, Etern (https://t.co/Rgl8i5e7N4), Everbright Photonics (https://t.co/hrQbVE0QlT), Shijia Photons (https://t.co/HvJVCM7BMm), Applied Optoelectronics (AAOI), Accelink (https://t.co/OjlKPLtkA4), Mitsubishi (6503.T)

Laser / Light Sources (EML): Lumentum (LITE), Coherent (COHR), Broadcom (AVGO), YJ Semi (https://t.co/qWTYoY2y6z), Etern (https://t.co/Rgl8i5e7N4), Sumitomo Electric (5802.T), Everbright Photonics (https://t.co/hrQbVE0QlT), Shijia Photons (https://t.co/HvJVCM7BMm), Source Photonics (Private), Mitsubishi (6503.T), Accelink (https://t.co/OjlKPLtkA4), Furukawa (5801.T)

Passive Optical Components - Couplers / Splitters: FOCI (3363.TWO), Senko (Private), AFR (https://t.co/v8bWvYaSCp), Everprox (https://t.co/PgwoMVPleI), Lumentum (LITE), Coherent (COHR)

Passive Optical Components - Filters: Shijia Photons (https://t.co/HvJVCM7BMm), Sumitomo Electric (5802.T), Lumentum (LITE), Coherent (COHR), Viavi (VIAV), FOCI (3363.TWO)

Passive Optical Components - Attenuators: Everprox (https://t.co/PgwoMVPleI), Accelink (https://t.co/OjlKPLtkA4), FOCI (3363.TWO), Lumentum (LITE)

Passive Optical Components - WDM: AFR (https://t.co/v8bWvYaSCp), Everprox (https://t.co/PgwoMVPleI), Accelink (https://t.co/OjlKPLtkA4), Ciena (CIEN), TFC Optical (https://t.co/fjsjeuQxcq), Lumentum (LITE), FOCI (3363.TWO)

[Ferr @dontbuytops]

Crazy that the only #stocks in Goldman Sachs report under the Indium Phosphide Epitaxial Waffers we got:

Sumitomo Electric Industries, Ltd. (5802.T) > 52b mcap
$IQE > 400M mcap

Feel the upside for $IQE just went 50x higher.

[Abraham John 🦄🦓 @Abmankendrick]

UI/UX Designers, this might be one of the cleanest color palette generators I’ve seen lately.

Kigen is a color generator that helps you quickly create beautiful palettes for your UI projects, making it easier to pick colors that actually work well together instead of guessing.

Bookmark it for later 💜

[Lee Black @mrblackstudio]

Sliced liquid glass made in @figma

[Nic Barker @nicbarkeragain]

Just a heads up that you should never be rendering 10,000 lines of anything, especially if all the lines are the same height, as in code.
List virtualisation is a very old and simple technique.
You can experiment with the below at https://t.co/Zm4IRrfh9j

[Photon Capital @PhotonCap]

Soitec $SOI / $SLOIF is up more than 370% YTD.
But step back to a 5-year view and the stock is still down 28.99%. So this is a recovery, not a breakout to new highs.

So what's behind the move?
SOI wafers feed a broad set of end markets (silicon photonics, RF, and others).

In silicon photonics, trying to build a chip without an SOI wafer is like trying to build a house without first buying the land.

Competitors?
Yes, you'll see names like SEH (Shin-Etsu Handotai), GlobalWafers, and Simgui.

But the IP sits with Soitec. Even when competitors generate revenue, Soitec collects a royalty on top through Smart Cut licensing.

About 80% of the SOI market runs on Smart Cut, so Soitec captures value either as product revenue or as royalty revenue across most of the ecosystem.

[Florian @flornkm]

Introducing the gradient border plugin

Familiar syntax, CSS-only, works everywhere. Easiest way for agents (and humans) to add border gradients via tailwind.

[BULL OF BRITAIN @BULLOFBRITAIN]

My opinion on the best companies for every role in Photonics - from someone with 1000+ hours on the sector.

Layer 1 (Equipment): $AIXA
Layer 2 (Substrates / Raw Materials): $SOI
Layer 3 (Epiwafers): $IQE
Layer 4 (PIC Fabrication / Foundry): $TSEM
Layer 5 (Lasers / Light Sources): $LITE
Layer 6 (Electronic ICs (Drivers / DSP / TIA): $MRVL
Layer 7 (Packaging / Assembly / CPO): $TSM
Layer 8 (Transceivers): $AAOI
Layer 9 (Passive Optics): $GLW
Layer 10 (Test & Measurement): $AEHR
Layer 11 (Switch ASICs): $NVDA
Layer 12 (Hyperscalers): $AMZN

[Michael | Hypermarkets @itsmichaelluu]

CHEATSHEAT and price targets for PHOTONICS STOCKS:

Here’s the full stack + WHY each matters + price targets 1 year from now:

1. MATERIALS & WAFERS

$AXTI — Enables indium phosphide wafers for ultra-fast optical chips
→ Current: ~$76 | PT: $130

$WOLF — Silicon carbide boosts efficiency, reduces heat in AI systems
→ Current: ~$32 | PT: $44

$COHR — Vertically integrated materials powering lasers + optical scaling
→ Current: ~$336 | PT: $400+

$LWLG — Electro-optic polymers unlock next-gen ultra-fast data transfer
→ Current: ~$12 | PT: $18

2. TOOLS

$ASML — EUV lithography = ONLY way to manufacture advanced AI chips
→ Current: ~$1,460 | PT: $1,800

$AMAT — Deposition + etch tools build photonic integrated circuits
→ Current: ~$420 | PT: $520+

$LRCX — Precision wafer processing = yield + scale for AI hardware
→ Current: ~$280 | PT: $360

3. LASERS

$LITE — Lasers + optical interconnects powering hyperscaler AI clusters
→ Current: ~$875 | PT: $1200

$LASR — Industrial + photonic lasers enabling chip manufacturing precision
→ Current: ~$76 | PT: $110

$SMTC — Optical + analog chips powering signal transmission in AI systems
→ Current: ~$110 | PT: $180

4. FOUNDRIES

$TSM — Manufactures advanced AI + photonic chips at global scale
→ Current: ~$410 | PT: $500

$TSEM — Specialty analog + photonics foundry for optical chips
→ Current: ~$200 | PT: $240

$GFS — Diversified chip manufacturing including photonics + RF
→ Current: ~$62 | PT: $90

$UMC — Cost-efficient manufacturing supporting optical IC production
→ Current: ~$12| PT: $20

$INTC — Building integrated photonics for AI interconnect dominance
→ Current: ~$82 | PT: $130

5. TEST, INSPECTION & PACKAGING

$AEHR — Burn-in testing ensures AI chips don’t fail at scale
→ Current: ~$97 | PT: $160

$VIAV — Tests optical networks for hyperscale AI performance
→ Current: ~$47 | PT: $70

$ONTO — Inspection systems ensure precision at nanometer scale
→ Current: ~$311 | PT: $360

$AMKR — Advanced packaging connects chips for AI compute clusters
→ Current: ~$80 | PT: $110

6. OPTICS (MODULE LAYER)

$AAOI — Transceivers moving data between GPUs at insane speeds
→ Current: ~$155 | PT: $260

$POET — Optical interposers enabling chip-to-chip photonic communication
→ Current: ~$15 | PT: $32

$GLW — Optical fiber backbone of global AI data traffic
→ Current: ~$176 | PT: $180

7. NETWORKING

$CRDO — High-speed connectivity chips for AI clusters + data centers
→ Current: ~$190 | PT: $240

$MRVL — Custom silicon + optical interconnects for AI infrastructure
→ Current: ~$170 | PT: $300

$AVGO — Dominates switching + networking chips for hyperscalers
→ Current: ~$420 | PT: $600

$ANET — AI-optimized networking for ultra-fast data center scaling
→ Current: ~$180 | PT: $240

$CIEN — Optical networking connecting global AI data centers
→ Current: ~$520 | PT: $650

[jhey ʕ•ᴥ•ʔ @jh3yy]

context-aware css card glow/shine effect 👨‍🍳

the trick: duplicate and scale the icon. translate it on pointermove. apply feGaussianBlur 🤙

check it 👇