CZ-10B rocket was being moved to its launchpad a few days ago👇
The launch will happen in 12 hours.
For the first time, recovery of its reusable stage will take place by a barge with a steel frame & cable system in the waters of Zhongsha Islands aka Macclesfield Bank.
People in competitive gaming can instantly recognise what Logitech mouse this Chinese make is after.
The nightmare: this one reportedly costs much less, ranging from one-tenth to one-fifth (depending on features) of the Logitech.
Crushing cruelty. Great news for consumers.
Yet another mega infrastructure project as part of the 15th five-year plan.
China will invest over 700 billion USD or near 5 trillion RMB in the next five years to build or upgrade 770,000 km of urban pipes for water, sewage, gas & heating.
Fusion reactors are another technology arena of the China-US competition. The construction of 200MW BEST reactor will complete by 2027, and generate the first drips of electricity in 2030.
In the US, Helion's Orion will generate electricity as early as 2028 albeit only 50MW.
A whopping ~30% young S. Koreans think they're the West. This perception was unimaginable 20 years ago.
These young men & women should take a look at themselves in the mirror.
Alexander Dennis is a double decker giant. BYD partnered with AD for 10 yrs & assembled electric double deckers in Europe for Transport for London. In 2024 BYD went independent. Produce new models in China & ship to TfL.
Real quick for a new player to enter double deckers.
A total of 22 made-in-China electric double-decker buses were shipped on Sunday from Yantai Port in east China’s Shandong Province to the United Kingdom. The buses will subsequently be put into service in London's public transport system.
IDK how LKY perceived the notion that Americans started from scratch and beat you.
Many living people have witnessed China started with rubbles & beat the West. Tactics include "stealing," imitating, reverse engineering & innovating.
My guess the US went thru the same process.
In Jul, there will be ZQ-3 (recovery test again) & the maiden flight of the recoverable CZ-10B. If we speculate a bit, the payloads will be a combined 54 SpaceSail sats.
Then we're left with 32 sats. That'll be another CZ-10B launch or two launches of CZ-6A & 8A each before Aug
For May, Jun & Jul, each month had two launches, sending a total of 108 SpaceSail satellites into orbit. Now a total of 238 sats in orbit.
But the firm's target is 324 sats by the end of Jul. They have to send another 86 to hit the goal.
How? Or delayed again to October?
For May, Jun & Jul, each month had two launches, sending a total of 108 SpaceSail satellites into orbit. Now a total of 238 sats in orbit.
But the firm's target is 324 sats by the end of Jul. They have to send another 86 to hit the goal.
How? Or delayed again to October?
Looks like for CXMT the long-term strategy is on MHC stacked DRAM. The medium-term is "bonded DRAM." Terrific if smoothly executed to the letter.
Though fool analysts from Bank of America are bold enough to write off CXMT like a fly. lol
CXMT is developing 3D DRAM with a novel method known as MHC. Succeeded in lab /w 5 layers, working towards 64 layers for mass production in 2031.
MHC to DRAM and CXMT is LogicFolding to logics and Huawei.
The difference in the era of 3D DRAM is DUV preferred over EUV. Surprise.
Why the anecdote?
Because DRAM producers are borrowing the exact idea for DRAM fabrication known as "bonded DRAM." Imminent product launches in a year or two.
China's own CXMT is one of them. Reportedly its production schedule is ahead of other global competitors.
China's YMTC launched "Xtacking" 3D NAND in 2019. All these yrs I thought it was a similar tech first commercialised by the Intel/Micron partnership several yrs earlier. Not really.
Xtacking pioneered the separation of periphery & NAND in 2 wafers, then hybrid bonded together.
China's YMTC launched "Xtacking" 3D NAND in 2019. All these yrs I thought it was a similar tech first commercialised by the Intel/Micron partnership several yrs earlier. Not really.
Xtacking pioneered the separation of periphery & NAND in 2 wafers, then hybrid bonded together.
>the concept of "gear ratio"
>i.e. pitch of hybrid bonding vs that of top metal layer
>the lower the gear ratio the better & ~1 is optimal
>LogicFolding is at ~3, aiming 1 towards 2035
>nanostack & LogicFolding require new EDA tools
>Huawei has the head start in EDA tooling
Huawei's He Tingbo released V2 of her Tau Scaling paper. Reaffirmed my judgement a week ago.
Without naming "nanostack" in V2, He pointed out
>nanostack not for production yet due to trapped heat
>yes, nanostack the ultimate fine-grained stacking - but
IBM Research's claimed breakthrough today known as "nanostack" overwhelmed my timeline. Quite a startling difference in reaction to Huawei's announcement of LogicFolding 30 days ago.
Pure prejudice and a bit of racism IMO. Looking from 500m above, both ideas appear similar to me