saveasART💎⛏️

generative artist, AI noob, loose money in crypto since day one.
$SIVE, $LPK,

[saveasART💎⛏️ @saveasART]

find my generative #Metaverse art at @withFND
https://t.co/VRMkpYHRmm

[saveasART💎⛏️ @saveasART]

@aleabitoreddit 我喜欢你 $Serenity

[saveasART💎⛏️ @saveasART]

@BTCdayu 他真不用，他每个回贴我都看过去，确实有点水平，直接去股市捡钱就行。
就是看他最近关注了不少crypto里的人，有点慌，不知道要干啥

[saveasART💎⛏️ @saveasART]

@vlmkapital @Compounding_K 🤣

[saveasART💎⛏️ @saveasART]

@JoeyOnMarkets @Balloon_Capital 👍

[saveasART💎⛏️ @saveasART]

这个账号不是一般人，尽然关注的人还没到100个，LFG $SIVE

[YoCooking @JoeyOnMarkets]

$SIVE roadmap to $10B MC along with timeline and events.
When you keep gaining confidence in $SIVE, pls review what happened in the past. It will reinforce why we begin this investment journey.

[YoCooking @JoeyOnMarkets]

$SIVE roadmap to $10B MC along with timeline and events.
When you keep gaining confidence in $SIVE, pls review what happened in the past. It will reinforce why we begin this investment journey.

[saveasART💎⛏️ @saveasART]

@billywu75 加油

[Mad dog research @maddogresearch]

@AntonLaVay TPU memory rack will use ALAB CXL

[saveasART💎⛏️ @saveasART]

“研究机构把玻璃核心基板的时间线搞错了。

2026年下半年（H2 2026）就应该开始量产（SKC Absolics），而不是2028年。而且到2040年的TAM数据看起来也有偏差，所以我觉得不引用它会更好。”

[Serenity @aleabitoreddit]

@talethdabm89 The research firm got their glass core substrate timelines off.

H2 2026 should be production start (SKC Absolics), not 2028. And TAM figures seems off toward 2040, so thought it was better not to cite it.

Even though it’s not full value chain like $LPK and GCS in specific

[saveasART💎⛏️ @saveasART]

@latent_value7 LPK moon?🚀

[saveasART💎⛏️ @saveasART]

SIVE 1年内再翻10倍，LFG

[Serenity @aleabitoreddit]

@Batemanzm75 I’m gonna go ahead and make a random prediction in a year:

$AAOI - $70B MC
$SIVE - $30B MC
Foci - $15B MC
Shunsin - $10B MC

[saveasART💎⛏️ @saveasART]

很少看到一个公司的前CEO还在一直跟踪分析之前自己经营过的公司，更证明SIVE是值得长期投资的公司。Send $SIVE to $40B

[Anders Storm @StormDirac]

Sivers Semiconductors $SIVE Q1 2026: Strong pipeline growth of 77% YTD, with softer sales YoY. Effected by US ChipAct delay and Fx in the short term.

Main focus in the investor call on pipeline growth, as well as the three super cycles AI, SATCOM and DoD.
2027 multiple ramp is anticipated;

Highlights:
-Opportunity Pipeline strengthened significantly
May 2026 Pipeline at $799M (77% increase from end of FY2025)

-US CHIPS Act Year 2 funding ($6.6M) for Electronic Warfare program

-Broad market beamformers and lasers igniting strong customer interest

Executing well on multiple product ramps for 2026/2027:

-Production builds in progress for Automotive LiDAR customer

-On-track for product readiness in 2027 for AI datacenter lasers

-Tachyon production PO ($3M) for 2026 and new 60 GHz contract

-Production orders imminent from lead SATCOM customer for 2027 ramp

-Tier-1 Telco vendor FWA product in advanced integration and trials

US Listing:
Investing in higher standards of financial control for US listing

$JBL update - Collaboration with Jabil:

- 1.6T Pluggables Differentiated, Low Power Linear Receive Optics (LRO) Pluggable Solution

- World-leading Contract Manufacturer (>$30B sales)
Investing in rapidly growing Intelligent Infra segment

- Strong entry into existing Pluggables market in AI datacenters

-Supporting builds for upcoming product qualification and field trials

Interesting near term triggers:
- Jabil Collaboration has triggered strong interest from other potential customers

- Production orders imminent from lead SATCOM customer for 2027 ramp

[saveasART💎⛏️ @saveasART]

把 $SIVE 喷到$40B

[Serenity @aleabitoreddit]

Only thing to look at with $SIVE earnings is forward growth.

Nobody cares about pre-development contract earnings from 2025 or last quarter, especially for qualification cycle optical players.

Having 77% growth of opportunity pipelines (revenue volume ramp projections), to $799m

In a quarter is absolutely incredible growth. And, I’d expect to see that continue compounding.

“The company continues to anticipate several volume production starts within AI data centers” (photonics/lasers).

Is also very positive and validates the thesis about volume ramp for photonics.

Now next thing to look at is earnings call transcript, once they’re indexed, which is the most important signal of what’s to come.

Overall, very positive.

[saveasART💎⛏️ @saveasART]

巨仓持有SIVE，上帝保佑今晚的财报。🙏

[saveasART💎⛏️ @saveasART]

赢家将是：SST（固态变压器）供应商、SiC（碳化硅）材料供应商，以及 DC busway（直流母线槽）厂商，它们会逐步获得新增的资本开支份额。

[Zephyr @zephyr_z9]

"Winners: SST vendors, SiC suppliers, and DC busway makers capture the incremental spend."

YES SIR

[saveasART💎⛏️ @saveasART]

@genZinvest0r @Nictoro14 @Ren_aramb 👍👍

[saveasART💎⛏️ @saveasART]

@aleabitoreddit 你就是我的股神

[saveasART💎⛏️ @saveasART]

send $LPK to 2B by end of 2026

[Serenity @aleabitoreddit]

@Ayouubb_ Nah I personally think it will end up $1.8B-2.2B MC by H1 2027.

[saveasART💎⛏️ @saveasART]

从现在开始，让 $SIVE 再涨20倍，让我财务自由想不做什么就可以不做什么。

[saveasART💎⛏️ @saveasART]

三星电机具备优势，因为其同时生产 MLCC 与封装载板，并据传正在越南厂规划新增设备投资。

[Jukan @jukan05]

▶ Embedded substrates draw AI chip interest as packaging turns strategic

- The growing interest in embedded substrates from major players like Nvidia, AMD, and Intel signals a potential shift in the AI datacenter supply chain.

- The technology can improve signal integrity and power stability for high-performance chips.

- Industry players are also developing EIPD (Embedded Integrated Passive Device) modules to simplify substrate processing and advanced packaging for AI and high-performance computing (HPC) chips.

- An embedded substrate features pre-formed cavities within the substrate to house passive components.

- The most commonly embedded component is the MLCC, with structures divided into semi-embedded and fully-embedded approaches.

- Compared with mounting passive components on the substrate surface, the embedded structure shortens signal paths and reduces parasitic inductance, making it advantageous for achieving impedance matching in the power delivery network (PDN).

- This is expected to improve signal integrity and power stability for AI and HPC chips.

- Embedded designs have already been adopted since the iPhone X-generation application processor (AP) as a way to free up limited PCB surface space.

- That said, large-scale adoption in the AI and server markets remains at an early stage. Embedding capacitors and resistors within the substrate raises costs, and no clear market leader has yet emerged in the industry.

- As a result, whether AI chip customers ultimately adopt the technology is set to become a key competitive variable.

- A range of suppliers—Japan's Ibiden, Korea's Samsung Electro-Mechanics, and Taiwan's Unimicron, Kinsus Tech, and Nan Ya PCB—are scaling up investment in embedded substrate development.

- Some market observers see Samsung Electro-Mechanics as holding an edge, given that it produces both MLCCs and package substrates and is reportedly planning new equipment investment at its Vietnam plant.

- Others, however, point to the stringent control required over materials, drilling precision, and surface flatness in embedded substrate manufacturing, and expect Ibiden and Unimicron to be the preferred partners for demanding AI customers.

- According to Taiwanese suppliers, inquiries about embedded substrates have surged from Nvidia, AMD, Intel, and ASIC customers focused on AI datacenter and HPC server chips.

- Design optimization concepts such as integrated passive device modules are still in the technology validation phase, but industry sources expect mass production to accelerate within the next few years.

- Substrate technology is emerging as a critical platform for supporting the rising power, bandwidth, and integration density of chips.