A new kind of factory is emerging — one that produces intelligence instead of goods.
Explore how Synopsys is helping enable the design and optimization of AI systems from the ground up: https://t.co/wHeOtwxdZL
Last week, Broadcom joined UCLA, GlobalFoundries, Meta, and Synopsys to launch the Semiconductor Hub at @UCLAengineering. The Hub will advance semiconductor research, workforce development, and AI-powered chip technologies.
Learn more: https://t.co/rJ5OQ1CaPy
How do teams achieve reliable signoff in complex 3D multi die designs? In this Synopsys On-Demand Webinar, @intel shares how its disaggregated client and server designs have driven the evolution of robust 3DIC construction & signoff methodologies: https://t.co/I4z5AU5PZL
Join us for the 2026 #Chiplets event on June 23-24 to learn more about how chiplets are being implemented today and how the industry is overcoming the real engineering challenges of scaling multi-die designs.
Register now: https://t.co/O2SqNBzgom
@Synopsys
#NVIDIAGTC Taipei News:
NVIDIA introduced NemoClaw, OpenShell and Nemotron models to help enterprises build AI coworkers.
@Cadence, @Dassault3DS, @Siemens and @Synopsys are using NVIDIA NemoClaw to create autonomous AI engineers that can compress weeks of simulation and verification work into hours.
Welcome Jesse Cohn to Synopsys' Board of Directors. Jesse is a Managing Partner at @Elliottinvmgmt with a long record of success as a director of public technology companies.
Read the full announcement: https://t.co/XABdcF9vgs
This past May, Synopsys Armenia signed a Letter of Intent with the @EU_Commission to jointly explore cooperation in microelectronics training chip design talent development across the European Union. 🤝
Together, we’re investing in skills, knowledge, and a shared future.
📰Our new LinkedIn #Newsletter is live, bringing you the biggest moments from May. This month showcases how we’re helping customers tackle increasing complexity and scale what’s possible.
Read, share and subscribe! 👇https://t.co/lGfsOzQYqZ
In 2021, Synopsys engineers made a prediction in the highly technical area of high-NA #EUV technology. Today, their prediction is proving correct.
Learn why lithography simulation is a strategic enabler for chip development: https://t.co/SmsBrw7v2B
🤝 Synopsys and @SamsungDSGlobal are enabling customers to accelerate time-to-market for AI & multi-die designs on advanced nodes, while delivering measurable, proven gains in quality.
Learn more about our announcements from their #SAFE2026 Forum: https://t.co/89cJ719z3n
You won't want to miss our upcoming virtual event centered around #chiplets! Register now for The Road to Chiplet Scalability here: https://t.co/C64zSef0YT
View insightful sessions like this panel with @Synopsys, @Cognichip, @Cadence, and @Siemens.
You’ve probably heard AI described as a five-layer stack (or cake 🍰).
But how do you deliver first-time-right silicon with this setup? Our Chief Product Development Officer Shankar Krishnamoorthy explains more below.
Watch the full replay: https://t.co/9LDYmwTc2P
Great to be celebrating the launch of the new Semiconductor Hub at @UCLAEngineering. I spent time with colleagues, young engineers, and the talented team that will be managing the program.
So proud to have @Synopsys supporting their efforts to accelerate innovation!
New in Fusion Compiler: PSX technology. By analyzing hundreds of scenarios in parallel, PSX helps identify risk earlier, streamline optimization, and improve predictability for demanding designs. Learn more: https://t.co/UjrKYDpoYr
Today, we proudly joined partners from @Broadcom, @Applied4Tech, @GFfab8 & @Meta to celebrate the launch of @UCLAengineering's new Semiconductor Hub.
Learn how we're helping to accelerate research & workforce development in AI-powered chip technologies: https://t.co/Qk2jjmcngz
Chip design is expanding fast.
@IanCutress talks with Synopsys CEO Sassine Ghazi on the shift from silicon to full system co-optimization — across chiplets, thermals, and software.
🎥 Watch: https://t.co/I1nSVOGr7B